Join ACH in Chicago for PackExpo 2016

By: Chris Benson, Packaging Specialist

2016_PACK_EXPO_International_LogoPackExpo is rapidly approaching as this year seems to be flying by.  The 2016 PackExpo will be Chicago, IL November 6th through the 9th at the McCormick Convention Center.

ACH Foam Technologies welcomes you attend and to stop by our booth at Upper Lakeside Center #E-6716  . We will have samples of our EPS manufacturing capabilities to show off along with a few of our highly knowledgeable and experienced sales team members to answer any questions.

For over four decades ACH Foam Technologies has been a leader in Expanded Polystyrene (EPS) manufacturing for packaging and industrial applications. With 8 manufacturing facilities across the United States, our customers have found ACH to be conveniently located, market competitive pricing on all our products, and a valued source to assist with any packaging or OEM solutions your company may need.

Please stop by the ACH Foam booth #E-6716 and meet our experienced and dedicated packaging team. We look forward to meeting you and working on a cost saving packaging solution that will meet your company’s needs.

We look forward to seeing you in Chicago!

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